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 2SK3579-01MR
FUJI POWER MOSFET
N-CHANNEL SILICON POWER MOSFET
Outline Drawings
TO-220F
Super FAP-G Series
Features
High speed switching Low on-resistance No secondary breadown Low driving power Avalanche-proof
Applications
Switching regulators UPS (Uninterruptible Power Supply) DC-DC converters
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25C unless otherwise specified)
Ratings Unit 150 V 130 V Continuous drain current 23 A 96 Pulsed drain current A Gate-source voltage 20 V 23 Repetitive or non-repetitive A Maximum Avalanche Energy 242 mJ 20 Maximum Drain-Source dV/dt kV/s Peak Diode Recovery dV/dt 5 kV/s 2.1 Max. power dissipation W 40 +150 Operating and storage Tch C -55 to +150 temperature range Tstg C Isolation Voltage VISO *6 2 kVrms < < < < *1 L=0.67mH, Vcc=48V *2 Tch=150C *3 IF=-ID, -di/dt=50A/s, Vcc=BVDSS, Tch=150C *4 VDS< 250V = *5 VGS=-20V *6 t=60sec f=60Hz Item Drain-source voltage Symbol VDS VDSX *5 ID ID(puls] VGS IAR *2 EAS *1 dVDS/dt *4 dV/dt *3 PD Ta=25C Tc=25C
Equivalent circuit schematic
Drain(D)
Gate(G) Source(S)
Electrical characteristics (Tc =25C unless otherwise specified)
Item Drain-source breakdown voltaget Gate threshold voltage Zero gate voltage drain current Gate-source leakage current Drain-source on-state resistance Symbol V(BR)DSS VGS(th) IDSS IGSS RDS(on) Test Conditions ID=250A VGS=0V VDS=VGS ID= 250A Tch=25C VDS=150V VGS=0V Tch=125C VDS=120V VGS=0V VGS=20V VDS=0V ID=11.5A VGS=10V
Min.
150 1.0
Typ.
Max.
2.5 25 250 100 90
Units
V V A nA m
10 65
Forward transcondutance Input capacitance Output capacitance Reverse transfer capacitance Turn-on time ton Turn-off time toff Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate-Internal Resistance (Tep.Confficient) Avalanche capability Diode forward on-voltage Reverse recovery time Reverse recovery charge
gfs Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD Rg Rg/ch IAV VSD trr Qrr
ID=11.5A VDS=75V VGS=0V f=1MHz
VDS=25V
12
VCC=48V ID=11.5A VGS=10V RGS=10 VCC=48V ID=23A VGS=10V 23.3 L=100H Tch=25C IF=23A VGS=0V Tch=25C IF=23A VGS=0V -di/dt=100A/s Tch=25C 23
24 1470 2200 190 285 18 27 24 36 23 35 300 450 45 68 48 72 6 9 12 18 39 54.4 0.12 1.10 0.13 0.6 1.65
S pF
ns
nC
%/C A V s C
Thermalcharacteristics
Item Thermal resistance Symbol Rth(ch-c) Rth(ch-a) Test Conditions channel to case channel to ambient
Min.
Typ.
Max.
3.125 58.0
Units
C/W C/W
1
2SK3579-01MR
Characteristics
Allowable Power Dissipation PD=f(Tc)
FUJI POWER MOSFET
Typical Output Characteristics
55 50 45 40 35
4.0V
50 45 40 35
ID=f(VDS):80s Pulse test,Tch=25C
20V 10V 8V 5.0V 4.5V
ID [A]
30
PD [W]
30 25
25 20
20 15 10 5 0 0 25 50 75 100 125 150
VGS=3.5V
15 10 5 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Tc [C]
VDS [V]
Typical Transfer Characteristic
ID=f(VGS):80s Pulse test, VDS=25V,Tch=25C
100 100
Typical Transconductance
gfs=f(ID):80s Pulse test, VDS=25V,Tch=25C
10
10
ID[A]
1
gfs [S]
1 0.1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.1 0.1
1
10
100
VGS[V]
ID [A]
Typical Drain-Source on-state Resistance
0.16 0.14 0.12
RDS(on)=f(ID):80s Pulse test, Tch=25C
VGS= 3.5V 4.0V
0.20 0.18 0.16 0.14
4.5V 5V 8V 10V 20V
Drain-Source On-state Resistance RDS(on)=f(Tch):ID=11.5A,VGS=10V
RDS(on) [ ]
RDS(on) [ ]
0.10 0.08 0.06 0.04 0.02
0.12 0.10 0.08 0.06 0.04 0.02
max. typ.
0.00 0 10 20 30 40 50
0.00 -50 -25 0 25 50 75 100 125 150
ID [A]
Tch [C]
2
2SK3579-01MR
FUJI POWER MOSFET
4.0 3.5
Gate Threshold Voltage vs. Tch VGS(th)=f(Tch):VDS=VGS,ID=1mA
Typical Gate Charge Characteristics
24 22 20
VGS=f(Qg):ID=23A, Tch=25C
3.0
18
max.
VGS(th) [V]
16 14
Vcc= 48V
2.5 2.0 1.5
VGS [V]
min.
12 10 8
1.0 0.5
6 4 2
0.0 -50 -25 0 25 50 75 100 125 150
0 0 10 20 30 40 50 60 70 80 90 100
Tch [C]
Qg [nC]
10
1
Typical Capacitance C=f(VDS):VGS=0V,f=1MHz
Typical Forward Characteristics of Reverse Diode
100
IF=f(VSD):80s Pulse test,Tch=25C
10
0
Ciss
10
VGS=10V VGS=0V
C [nF]
Coss
10
-1
IF [A]
1 10
-2
Crss
-1
10
10
0
10
1
10
2
10
3
0.1 0.00
0.25
0.50
0.75
1.00
1.25
1.50
VDS [V]
VSD [V]
Typical Switching Characteristics vs. ID
10
3
t=f(ID):Vcc=48V, VGS=10V, RG=10
300
Maximum Avalanche Energy vs. starting Tch E(AV)=f(starting Tch):Vcc=48V,I(AV)<=23A
250
tf
10
2
200
td(off)
EAV [mJ]
t [ns]
td(on) tr
150
10
1
100
50
10
0
0
-1
10
10
0
10
1
10
2
0
25
50
75
100
125
150
ID [A]
starting Tch [C]
3
2SK3579-01MR
FUJI POWER MOSFET
80 70 60 50
Gate-Internal Resistance vs. Tch RG=f(Tch):f=1MHz,VDS=0V
max.
RG [ ]
Typ.
40 30 20 10 0 -50 -25 0 25 50 75 100 125 150
min.
Tch [C]
Maximum Avalanche Current Pulsewidth
10
2
IAV=f(tAV):starting Tch=25C. Vcc=48V
Avalanche current IAV [A]
Single Pulse
10
1
10
0
10
-1
10 -8 10
-2
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
tAV [sec]
10
1
Transient Thermal impedance Zth(ch-c)=f(t) :D=0
Zth(ch-c) [K/W]
10
0
10
-1
10 -5 10
-2
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t [s]
4


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